Operation guide for reflow soldering temperature curve testing


1. Set the temperature parameters, process boundaries and reflow soldering wave soldering furnace temperature settings:
 
1.1 According to the solder paste model, special component specifications, special measurement positions, FPC process and customer requirements, the engineer formulates a reasonable temperature curve test range, including: specific parameters and definitions of heating zone, immersion (insulation) zone, reflow zone and cooling zone
1.2 Preheating area: usually refers to the area that is heated from room temperature to about 150 degrees. In this temperature zone, the heating rate should not be too fast, generally not more than 3 degrees per second. In order to prevent the components from heating up too fast and causing the deformation of the substrate or the micro-cracking of the components.
1.3 Immersion (insulation) area: usually refers to the area of about 110 degrees ~ 190 degrees. In this temperature zone, the flux further evaporates and helps the substrate clear of oxides, and the substrate and components reach thermal equilibrium in preparation for high-temperature reflow. The general duration of this area is 60~120 seconds.
1.4 Reflux area: usually refers to the temperature area above 217 degrees. In this temperature zone, the solder paste melts quickly, quickly wets the solder surface, and forms a new alloy solder layer with the substrate PAD, achieving a good weld between the component and the PAD. The duration of this zone is generally set as: 45~90 seconds. The maximum temperature generally does not exceed 250 degrees (unless specifically required).
1.5 Cooling zone: This zone is the rapid cooling of the solder joint, solidifying the solder, refining the solder lattice, and improving the welding strength. The cooling rate in this area is generally set to about -3~-1 degrees/second.
1.6 Set the temperature zone length, temperature zone temperature, chain speed, etc. of reflow soldering wave soldering
 
 
2. The production of temperature measuring plates
 
2.1 The sample plate consistent with the production part number is used as the temperature measuring plate, and the necessary representative temperature measurement components should be retained in principle when making the temperature measuring plate, so as to ensure that the test and measurement temperature is consistent with the actual production temperature.
2.2 In the case that the temperature measuring plate and the production part number cannot be consistent, the same type of temperature measuring plate can be used for measurement after verification and approval by the engineer.
2.3 The temperature measurement point should select the most representative area and components, such as the maximum and minimum heat absorption components, part selection priority (such as Socket->Motor-> large BGA-> small BGA-> QFP or SOP-> standard Chip), in addition, a temperature measurement zone between the two should be selected.
2.4 The general temperature measurement points shall not be less than 3 on each board, and at least 4 of them shall be selected for BGA or large IC, and the components shall be selected based on the principle of special representative components as the first choice.
2.5 Position distribution: The whole board diagonal method or 4 corners and 1 center point method can cover the position distribution of the whole board.
2.6 The temperature measuring line should be fixed on the temperature measuring plate with high temperature resistant yellow tape or red glue.
 
3. Test the furnace temperature curve
 
3.1 According to the temperature process limit set by the engineer, the furnace temperature test technician presets the furnace temperature in each zone based on different reflow oven structures to meet the temperature process requirements.
3.2 Insert the thermocouple on the thermometer plate into the jack of the tester in turn. Wear a protective case while noting that the air wire must be inserted into the first jack.
3.3 After the furnace temperature is set, the temperature plate can be used for testing only after the green light of the reflow oven is normally lit.
3.4 Carefully put the temperature measuring plate and tester into the reflow soldering conveyor belt or chain, and turn on the power supply of the tester and record the data switch, and the way to feed the board should be the same as that of the board produced.
3.5 After the test is completed, take out the tester at the end of the board.
3.6 Read out the temperature curve on the computer side and check whether the curve is within a reasonable process range, otherwise the technician needs to continue to debug the temperature of each zone until the temperature curve that meets the process boundary is measured.
 
 
4. Data collection
 
1 Open the KIC temperature measurement program on the computer as shown in the figure. And check whether the solder paste process is OK.
2 Input relevant information including furnace temperature, temperature zone, chain speed, test channel, etc.
3Connect the thermometer according to the prompts and start reading the data.
4. Analyze the data according to the requirements of the temperature curve, and print out the temperature curve that meets the requirements for archiving.
5. Fill in the "Temperature Curve Confirmation Form", and post it on the reflow oven after being confirmed OK by ME and IPQC.
 
5. Check after the furnace
 
Check the welding condition of the substrate at this temperature setting after passing through the furnace, and confirm the reasonableness of the setting range and furnace temperature parameters according to the welding yield.
 
6. Test frequency: 0.05-30MIN can be automatically selected
 
The temperature curve of reflow soldering is tested by the technician once a day, and if the line is changed, it should be redone, and the correct temperature curve diagram should be printed, and the corresponding "Temperature Profile Confirmation Form" should be filled in.
 
7. Precautions:
 
7.1 If the customer needs to measure the temperature of the IC/QFP, the thermocouple wire should be connected to the pin of the IC.
7.2 If the customer needs to measure the BGA temperature, it is necessary to drill a hole in the position of the BGA pad on the front of the test board until the reverse side, insert the thermocouple wire from the reverse side of the test board into the solder joint of the BGA, and solder the entire BGA on the test board at the same time.
7.3 When you need to measure the temperature of the hand-soldered element, the thermocouple wire should be passed through the solder hole from the front, and the length of the test board should be 1.5-2mm to contact the tin wave.
7.4 Pay attention to safety during the test to prevent high temperature burns.
7.5 If you have any questions, please call our after-sales service.

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