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Introduction to SMT Technology Related Knowledge
2013-10-18
Surface mounting technology (SMT) is a new generation of electronic assembly technology that compresses traditional electronic components into devices with a volume of only a few tens of times, achieving high-density, high reliability, miniaturization, low cost, and automated production of electronic product assembly.
Introduction to Wave soldering temperature curve and temperature control standards
2013-10-15
Wave soldering refers to the process of injecting molten soft solder (lead-tin alloy) through an electric or electromagnetic pump into the designed solder wave peak. It can also be formed by injecting nitrogen gas into the solder pool, allowing pre installed printed boards with components to pass through the solder wave peak and achieve mechanical and electrical soft soldering between the component solder end or lead and the printed board solder pad.
Operation guide for reflow soldering temperature curve testing
2013-10-12
Engineers develop a reasonable temperature curve testing range based on solder paste model, special component specifications, special measurement positions, FPC process, and customer requirements, including specific parameters and definitions for the heating zone, soaking (insulation) zone, reflux zone, and cooling zone