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PCBA Lecture Hall: Should RSS be used for the furnace temperature curve of reflow soldering? Or RTS type?

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2022-10-16 10:45

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PCBA Lecture Hall: Should RSS be used for the furnace temperature curve of reflow soldering? Or RTS type?
PCBA Lecture Hall: Should RSS be used for the furnace temperature curve of reflow soldering? Or RTS type?
Should the Reflow temperature profile be set to RSS (saddle type)? Or should it be set to RTS type (ramp-up type)? TESDATA FOUND THAT MANY PCBA ENGINEERS HAVE BEEN TROUBLED BY THIS PROBLEM, BECAUSE SOME BOSSES ASKED TO TAKE RTS, BUT THEY WERE AFRAID OF IT. Actually, there is no difficulty in answering this question, but you must first understand what "RSS" and "RTS" temperature curves are, and only after understanding the purpose and limitations of their curve settings can you choose a reflow temperature profile that meets your product. In this article, TESDATA tries to sort out the characteristics of the two types of reflow soldering temperature curves, "RSS type" and "RTS type", and the problems they are currently encountering, and provide a direction to choose. TESDATA doesn't dare to say that the following are the most correct, but put forward personal opinions for your reference, please think twice before adopting. RSS:Ramp-Soak-Spike Heating-Endothermy-Reflow Some people translate the "Soak zone" in the reflow curve as "constant temperature zone" and some people translate it as "infiltration zone", but Mr. Bai suggests that it should be translated as "endothermic zone" or "active zone". As the name suggests, the temperature curve is that there will be a flat constant temperature area, because the temperature curve is drawn like a "saddle" (a flat place can sit on a person), so the "RSS type" reflow temperature curve is also called "saddle type". RSS (Ramp-Soak-Spike) The main purpose of this constant temperature zone setting before resoldering is to make all the solder pads/pads on the surface of the PCB connected with a large area of grounded copper foil and a small area of copper foil ungrounded, and so that the temperature of components and solder legs of different sizes and textures can reach the same temperature before entering the reflow area, and the best soldering effect can be achieved during resoldering, which is why Mr. Bai suggested that this area be called the "endothermic zone". Let all objects that want to enter the reflow solder absorb the heat to a consistent temperature. It's like waiting for a while before marching to battle, gathering all the scattered soldiers together, and then charging forward in one go, which is a bit similar, otherwise everyone will be easily broken by each piece. If the temperature of SMD components is uneven (the "temperature difference △T" is too large), it is easy to have the disadvantages of soldering: ▪ If the temperature of SMD components is inconsistent when entering the reflow area, it is easy to have parts that are not soldered in place (insufficient temperature) or parts that are scalded and melted (the temperature is too high or the temperature is too long). ▪ If the PCB pad/pad of the same part cannot reach the same temperature before entering the reflow zone, it is prone to tombstone effect, and BGA is prone to HoP/HiP or NWO disadvantages. ▪ If the solder pads/pads of the part and the corresponding pads cannot reach the same temperature before entering the reflow zone, it is easy to have the disadvantage that all the solder will crawl to the solder feet (siphon phenomenon) or the solder feet will not stick to the tin. In the current SAC305 lead-free solder paste resoldering process, the temperature of this constant temperature zone is usually maintained in the range of 150±10°C, and this temperature is basically maintained on the eve of the solder paste melting, on the one hand, waiting for the large army to assemble (so that the temperature tends to be consistent), on the other hand, the flux in the solder paste will begin to play the role of removing oxides. However, it should be noted that at the temperature of this constant temperature zone, the solvent originally added to the flux of the solder paste will also begin to accelerate volatilization due to the increase in temperature, although the activator will also start and begin to remove the oxide on the surface of the solder, but the best time to remove the oxide should be when the solder paste has just begun to melt, because the melted solder paste can be pushed and removed by liquid tin to the edge or outside of the entire solder, so that there will be no oxide residue when the solder is formed and cause solder defects. Therefore, according to the characteristics of the solder paste flux, theoretically, the temperature of this constant temperature zone should not be too high or too long, otherwise the flux will dry up quickly, which is not conducive to the performance of the flux when the solder is melted, because the amount of flux residue when entering the reflux area will be directly related to the quality of the soldering~ This is the key point that many PCBA engineers ignore. For this reason, all solder paste manufacturers should tell you that the temperature of the constant temperature zone should not be set too high, let alone too long, and the heating slope after the constant temperature zone should not be too low, and it is not recommended to be lower than 1 °C/Sec, the purpose is to retain the most flux into the reflow area, if the flux is greatly reduced before entering the refill, the shortcomings of air soldering (non-wetting), cold soldering (De-wetting) and HoP/HiP or NWO will be greatly increased. However, if the slope of the secondary heating is too fast, the problem of "tin splashing" will occur, imagine the situation when the pan is frying the fish too large and the fish is put into the oil pan, appropriately reducing the slope of the secondary heating will help reduce the "tin splash". Therefore, the setting of the slope is simply a narrow door. In principle, it is not recommended to exceed 3 °C/Sec, because there is rosin in the flux of solder paste, and its softening point is about 90 °C ~ 110 °C short)。 RTS: Ramp-To-Spike Heating directly to reflow, eliminating the need for a constant temperature zone RTS type reflow curve is also known as "hill type" or "ramp type". RSS (Ramp-Soak-Spike) Saddle Reflow Curve As mentioned in the previous article, so many RSS constant temperature zones prevent fluxes from achieving optimal soldering results. Therefore, the main purpose of this RTS type reflux curve is to meet the characteristics of the flux as the premise of the design of the temperature return curve, since the RSS constant temperature zone will make the flux accelerate volatilization and drying, then do not want this constant temperature zone, or change this constant temperature zone to a slow heating zone, which can not only greatly reduce the rate of flux volatilization, improve the flux residue rate during resoldering, but also improve the solderability of resoldering (if you can't understand this paragraph, Please go back to the article and revisit the characteristics of the RSS type reflow curve), and it can also shorten the time of the entire reflow through the furnace, which is equivalent to achieving the effect of saving energy, why not? However, the elimination of the "constant temperature zone" means that the "temperature difference △T" may increase, so as long as all the pads/pads on the board and the solder legs of all parts are controlled not to be too high before entering the recycle temperature, this RTS-type reflow curve should be used. Which PCBA boards are suitable for RTS reflow curve? With the development of science and technology, more and more reflow ovens now have the ability to compensate for efficient thermal energy, especially those reflow ovens with more than 10 temperature zones, which will no longer have the problem of high and low drift of temperature because of the density of the board in the reflow furnace, which is very helpful for the use of RTS in the reflow furnace, because there is a very important limitation when designing RSS, that is, the thermal efficiency of the reflow furnace cannot keep up. Therefore, having a reflow oven with high efficiency thermal compensation is an important condition for the use of RTS. RTS (Ramp-To-Spike) Ramp-To-Spike Reflow Curve Compromise Again, if the parts on your PCBA are very simple, without too many complex parts, such as BGA or large parts that are particularly easy or not easy to absorb heat, that is to say, the temperature between the parts can easily reach uniformity, it is recommended to use "RTS ramp-to-spike". However, if your board is too large or has too many layers, even if the parts are simple, it is recommended to measure whether the temperature of each key position can be consistent before entering the reflow area through the temperature measuring plate. After confirming that it is feasible, first try run a small amount to ensure that the solder defects are within the controllable range, and then produce in large quantities, and observe a few batches of no problems before you can really rest assured that the production line can change the reflow curve to RTS. The reason is that most of the plate spacing in the reflow furnace is loose during the test run, but the board spacing is shortened after a large number of productions, coupled with the insufficient energy supply of the reproduction furnace, so the phenomenon of non-tin is caused, especially the soldering pads/pads connected with a large area of grounded copper foil are more serious. Now you should know that your reflow temperature profile should be set to RSS? Or set it to RTS type~
 
Should the Reflow temperature profile be set to RSS (saddle type)? Or should it be set to RTS type (ramp-up type)? TESDATA FOUND THAT MANY PCBA ENGINEERS HAVE BEEN TROUBLED BY THIS PROBLEM, BECAUSE SOME BOSSES ASKED TO TAKE RTS, BUT THEY WERE AFRAID OF IT.
 
Actually, there is no difficulty in answering this question, but you must first understand what "RSS" and "RTS" temperature curves are, and only after understanding the purpose and limitations of their curve settings can you choose a reflow temperature profile that meets your product.
 
In this article, TESDATA tries to sort out the characteristics of the two types of reflow soldering temperature curves, "RSS type" and "RTS type", and the problems they are currently encountering, and provide a direction to choose. TESDATA doesn't dare to say that the following are the most correct, but put forward personal opinions for your reference, please think twice before adopting.
 
RSS: Ramp-Soak-Spike Heat Up-Endothermy-Reflow
The "Soak zone" in the reflow curve is translated as "constant temperature zone" and some people translate it as "infiltration zone", but Mr. Bai suggests that it should be translated as "endothermic zone" or "active zone". As the name suggests, the temperature curve is that there will be a flat constant temperature area, because the temperature curve is drawn like a "saddle" (a flat place can sit on a person), so the "RSS type" reflow temperature curve is also called "saddle type".
 
Should the Reflow temperature profile be set to RSS (saddle type)? Or should it be set to RTS type (ramp-up type)? TESDATA FOUND THAT MANY PCBA ENGINEERS HAVE BEEN TROUBLED BY THIS PROBLEM, BECAUSE SOME BOSSES ASKED TO TAKE RTS, BUT THEY WERE AFRAID OF IT. Actually, there is no difficulty in answering this question, but you must first understand what "RSS" and "RTS" temperature curves are, and only after understanding the purpose and limitations of their curve settings can you choose a reflow temperature profile that meets your product. In this article, TESDATA tries to sort out the characteristics of the two types of reflow soldering temperature curves, "RSS type" and "RTS type", and the problems they are currently encountering, and provide a direction to choose. TESDATA doesn't dare to say that the following are the most correct, but put forward personal opinions for your reference, please think twice before adopting. RSS:Ramp-Soak-Spike Heating-Endothermy-Reflow Some people translate the "Soak zone" in the reflow curve as "constant temperature zone" and some people translate it as "infiltration zone", but Mr. Bai suggests that it should be translated as "endothermic zone" or "active zone". As the name suggests, the temperature curve is that there will be a flat constant temperature area, because the temperature curve is drawn like a "saddle" (a flat place can sit on a person), so the "RSS type" reflow temperature curve is also called "saddle type". RSS (Ramp-Soak-Spike) The main purpose of this constant temperature zone setting before resoldering is to make all the solder pads/pads on the surface of the PCB connected with a large area of grounded copper foil and a small area of copper foil ungrounded, and so that the temperature of components and solder legs of different sizes and textures can reach the same temperature before entering the reflow area, and the best soldering effect can be achieved during resoldering, which is why Mr. Bai suggested that this area be called the "endothermic zone". Let all objects that want to enter the reflow solder absorb the heat to a consistent temperature. It's like waiting for a while before marching to battle, gathering all the scattered soldiers together, and then charging forward in one go, which is a bit similar, otherwise everyone will be easily broken by each piece. If the temperature of SMD components is uneven (the "temperature difference △T" is too large), it is easy to have the disadvantages of soldering: ▪ If the temperature of SMD components is inconsistent when entering the reflow area, it is easy to have parts that are not soldered in place (insufficient temperature) or parts that are scalded and melted (the temperature is too high or the temperature is too long). ▪ If the PCB pad/pad of the same part cannot reach the same temperature before entering the reflow zone, it is prone to tombstone effect, and BGA is prone to HoP/HiP or NWO disadvantages. ▪ If the solder pads/pads of the part and the corresponding pads cannot reach the same temperature before entering the reflow zone, it is easy to have the disadvantage that all the solder will crawl to the solder feet (siphon phenomenon) or the solder feet will not stick to the tin. In the current SAC305 lead-free solder paste resoldering process, the temperature of this constant temperature zone is usually maintained in the range of 150±10°C, and this temperature is basically maintained on the eve of the solder paste melting, on the one hand, waiting for the large army to assemble (so that the temperature tends to be consistent), on the other hand, the flux in the solder paste will begin to play the role of removing oxides. However, it should be noted that at the temperature of this constant temperature zone, the solvent originally added to the flux of the solder paste will also begin to accelerate volatilization due to the increase in temperature, although the activator will also start and begin to remove the oxide on the surface of the solder, but the best time to remove the oxide should be when the solder paste has just begun to melt, because the melted solder paste can be pushed and removed by liquid tin to the edge or outside of the entire solder, so that there will be no oxide residue when the solder is formed and cause solder defects. Therefore, according to the characteristics of the solder paste flux, theoretically, the temperature of this constant temperature zone should not be too high or too long, otherwise the flux will dry up quickly, which is not conducive to the performance of the flux when the solder is melted, because the amount of flux residue when entering the reflux area will be directly related to the quality of the soldering~ This is the key point that many PCBA engineers ignore. For this reason, all solder paste manufacturers should tell you that the temperature of the constant temperature zone should not be set too high, let alone too long, and the heating slope after the constant temperature zone should not be too low, and it is not recommended to be lower than 1 °C/Sec, the purpose is to retain the most flux into the reflow area, if the flux is greatly reduced before entering the refill, the shortcomings of air soldering (non-wetting), cold soldering (De-wetting) and HoP/HiP or NWO will be greatly increased. However, if the slope of the secondary heating is too fast, the problem of "tin splashing" will occur, imagine the situation when the pan is frying the fish too large and the fish is put into the oil pan, appropriately reducing the slope of the secondary heating will help reduce the "tin splash". Therefore, the setting of the slope is simply a narrow door. In principle, it is not recommended to exceed 3 °C/Sec, because there is rosin in the flux of solder paste, and its softening point is about 90 °C ~ 110 °C short)。 RTS: Ramp-To-Spike Heating directly to reflow, eliminating the need for a constant temperature zone RTS type reflow curve is also known as "hill type" or "ramp type". RSS (Ramp-Soak-Spike) Saddle Reflow Curve As mentioned in the previous article, so many RSS constant temperature zones prevent fluxes from achieving optimal soldering results. Therefore, the main purpose of this RTS type reflux curve is to meet the characteristics of the flux as the premise of the design of the temperature return curve, since the RSS constant temperature zone will make the flux accelerate volatilization and drying, then do not want this constant temperature zone, or change this constant temperature zone to a slow heating zone, which can not only greatly reduce the rate of flux volatilization, improve the flux residue rate during resoldering, but also improve the solderability of resoldering (if you can't understand this paragraph, Please go back to the article and revisit the characteristics of the RSS type reflow curve), and it can also shorten the time of the entire reflow through the furnace, which is equivalent to achieving the effect of saving energy, why not? However, the elimination of the "constant temperature zone" means that the "temperature difference △T" may increase, so as long as all the pads/pads on the board and the solder legs of all parts are controlled not to be too high before entering the recycle temperature, this RTS-type reflow curve should be used. Which PCBA boards are suitable for RTS reflow curve? With the development of science and technology, more and more reflow ovens now have the ability to compensate for efficient thermal energy, especially those reflow ovens with more than 10 temperature zones, which will no longer have the problem of high and low drift of temperature because of the density of the board in the reflow furnace, which is very helpful for the use of RTS in the reflow furnace, because there is a very important limitation when designing RSS, that is, the thermal efficiency of the reflow furnace cannot keep up. Therefore, having a reflow oven with high efficiency thermal compensation is an important condition for the use of RTS. RTS (Ramp-To-Spike) Ramp-To-Spike Reflow Curve Compromise Again, if the parts on your PCBA are very simple, without too many complex parts, such as BGA or large parts that are particularly easy or not easy to absorb heat, that is to say, the temperature between the parts can easily reach uniformity, it is recommended to use "RTS ramp-to-spike". However, if your board is too large or has too many layers, even if the parts are simple, it is recommended to measure whether the temperature of each key position can be consistent before entering the reflow area through the temperature measuring plate. After confirming that it is feasible, first try run a small amount to ensure that the solder defects are within the controllable range, and then produce in large quantities, and observe a few batches of no problems before you can really rest assured that the production line can change the reflow curve to RTS. The reason is that most of the plate spacing in the reflow furnace is loose during the test run, but the board spacing is shortened after a large number of productions, coupled with the insufficient energy supply of the reproduction furnace, so the phenomenon of non-tin is caused, especially the soldering pads/pads connected with a large area of grounded copper foil are more serious. Now you should know that your reflow temperature profile should be set to RSS? Or set it to RTS type~
 
 
The main purpose of setting the constant temperature zone before resoldering is to make all the solder pads/pads on the surface of the PCB connected with a large area of grounded copper foil and a small area of copper foil ungrounded, and to make the temperature of components and solder legs of different sizes and textures reach the same temperature before entering the resoldering area, and the best soldering effect can be achieved during resoldering. It's like waiting for a while before marching to battle, gathering all the scattered soldiers together, and then charging forward in one go, which is a bit similar, otherwise everyone will be easily broken by each piece.
 
If the temperature is uneven during reflow soldering (the "temperature difference △T" is too large), it is easy to have the disadvantages of soldering:
 
▪ If the temperature of SMD components is inconsistent when entering the reflow area, it is easy to have parts that are not welded in place (insufficient temperature) or parts that are scalded and melted (the temperature is too high or the temperature is too long).
▪ If the PCB pad/pad of the same part cannot reach the same temperature before entering the reflow zone, it is prone to tombstone effect, and BGA is prone to HoP/HiP or NWO disadvantages.
▪ If the solder pads/pads of the part and the corresponding pads cannot reach the same temperature before entering the reflow zone, it is easy to have the disadvantage that all the solder will crawl to the solder feet (siphon phenomenon) or the solder feet will not stick to the tin.
 
In the current SAC305 lead-free solder paste resoldering process, the temperature of this constant temperature zone is usually maintained in the range of 150±10°C, and this temperature is basically maintained on the eve of the solder paste melting, on the one hand, waiting for the large army to assemble (so that the temperature tends to be consistent), on the other hand, the flux in the solder paste will begin to play the role of removing oxides.
 
However, it should be noted that at the temperature of this constant temperature zone, the solvent originally added to the flux of the solder paste will also begin to accelerate volatilization due to the increase in temperature, although the activator will also start and begin to remove the oxide on the surface of the solder, but the best time to remove the oxide should be when the solder paste has just begun to melt, because the melted solder paste can be pushed and removed by liquid tin to the edge or outside of the entire solder, so that there will be no oxide residue when the solder is formed and cause solder defects.
 
Therefore, according to the characteristics of the solder paste flux, theoretically, the temperature of this constant temperature zone should not be too high or too long, otherwise the flux will dry up quickly, which is not conducive to the performance of the flux when the solder is melted, because the amount of flux residue when entering the reflux area will be directly related to the quality of the soldering~ This is the key point that many PCBA engineers ignore.
 
For this reason, all solder paste manufacturers should tell you that the temperature of the constant temperature zone should not be set too high, let alone too long, and the heating slope after the constant temperature zone should not be too low, and it is not recommended to be lower than 1 °C/Sec, the purpose is to retain the most flux into the reflow area, if the flux is greatly reduced before entering the refill, the shortcomings of air soldering (non-wetting), cold soldering (De-wetting) and HoP/HiP or NWO will be greatly increased. However, if the slope of the secondary heating is too fast, the problem of "tin splashing" will occur, imagine the situation when the pan is frying the fish too large and the fish is put into the oil pan, appropriately reducing the slope of the secondary heating will help reduce the "tin splash". Therefore, the setting of the slope is simply a narrow door.
 
In principle, it is not recommended to exceed 3 °C/Sec, because there is rosin in the flux of solder paste, and its softening point is about 90 °C ~ 110 °C short)。
 
RTS: Ramp-To-Spike heating directly to reflow, eliminating the need for a constant temperature zone
 
The RTS type reflow curve is also known as the "hill type" or "ramp type".

 
Should the Reflow temperature profile be set to RSS (saddle type)? Or should it be set to RTS type (ramp-up type)? TESDATA FOUND THAT MANY PCBA ENGINEERS HAVE BEEN TROUBLED BY THIS PROBLEM, BECAUSE SOME BOSSES ASKED TO TAKE RTS, BUT THEY WERE AFRAID OF IT. Actually, there is no difficulty in answering this question, but you must first understand what "RSS" and "RTS" temperature curves are, and only after understanding the purpose and limitations of their curve settings can you choose a reflow temperature profile that meets your product. In this article, TESDATA tries to sort out the characteristics of the two types of reflow soldering temperature curves, "RSS type" and "RTS type", and the problems they are currently encountering, and provide a direction to choose. TESDATA doesn't dare to say that the following are the most correct, but put forward personal opinions for your reference, please think twice before adopting. RSS:Ramp-Soak-Spike Heating-Endothermy-Reflow Some people translate the "Soak zone" in the reflow curve as "constant temperature zone" and some people translate it as "infiltration zone", but Mr. Bai suggests that it should be translated as "endothermic zone" or "active zone". As the name suggests, the temperature curve is that there will be a flat constant temperature area, because the temperature curve is drawn like a "saddle" (a flat place can sit on a person), so the "RSS type" reflow temperature curve is also called "saddle type". RSS (Ramp-Soak-Spike) The main purpose of this constant temperature zone setting before resoldering is to make all the solder pads/pads on the surface of the PCB connected with a large area of grounded copper foil and a small area of copper foil ungrounded, and so that the temperature of components and solder legs of different sizes and textures can reach the same temperature before entering the reflow area, and the best soldering effect can be achieved during resoldering, which is why Mr. Bai suggested that this area be called the "endothermic zone". Let all objects that want to enter the reflow solder absorb the heat to a consistent temperature. It's like waiting for a while before marching to battle, gathering all the scattered soldiers together, and then charging forward in one go, which is a bit similar, otherwise everyone will be easily broken by each piece. If the temperature of SMD components is uneven (the "temperature difference △T" is too large), it is easy to have the disadvantages of soldering: ▪ If the temperature of SMD components is inconsistent when entering the reflow area, it is easy to have parts that are not soldered in place (insufficient temperature) or parts that are scalded and melted (the temperature is too high or the temperature is too long). ▪ If the PCB pad/pad of the same part cannot reach the same temperature before entering the reflow zone, it is prone to tombstone effect, and BGA is prone to HoP/HiP or NWO disadvantages. ▪ If the solder pads/pads of the part and the corresponding pads cannot reach the same temperature before entering the reflow zone, it is easy to have the disadvantage that all the solder will crawl to the solder feet (siphon phenomenon) or the solder feet will not stick to the tin. In the current SAC305 lead-free solder paste resoldering process, the temperature of this constant temperature zone is usually maintained in the range of 150±10°C, and this temperature is basically maintained on the eve of the solder paste melting, on the one hand, waiting for the large army to assemble (so that the temperature tends to be consistent), on the other hand, the flux in the solder paste will begin to play the role of removing oxides. However, it should be noted that at the temperature of this constant temperature zone, the solvent originally added to the flux of the solder paste will also begin to accelerate volatilization due to the increase in temperature, although the activator will also start and begin to remove the oxide on the surface of the solder, but the best time to remove the oxide should be when the solder paste has just begun to melt, because the melted solder paste can be pushed and removed by liquid tin to the edge or outside of the entire solder, so that there will be no oxide residue when the solder is formed and cause solder defects. Therefore, according to the characteristics of the solder paste flux, theoretically, the temperature of this constant temperature zone should not be too high or too long, otherwise the flux will dry up quickly, which is not conducive to the performance of the flux when the solder is melted, because the amount of flux residue when entering the reflux area will be directly related to the quality of the soldering~ This is the key point that many PCBA engineers ignore. For this reason, all solder paste manufacturers should tell you that the temperature of the constant temperature zone should not be set too high, let alone too long, and the heating slope after the constant temperature zone should not be too low, and it is not recommended to be lower than 1 °C/Sec, the purpose is to retain the most flux into the reflow area, if the flux is greatly reduced before entering the refill, the shortcomings of air soldering (non-wetting), cold soldering (De-wetting) and HoP/HiP or NWO will be greatly increased. However, if the slope of the secondary heating is too fast, the problem of "tin splashing" will occur, imagine the situation when the pan is frying the fish too large and the fish is put into the oil pan, appropriately reducing the slope of the secondary heating will help reduce the "tin splash". Therefore, the setting of the slope is simply a narrow door. In principle, it is not recommended to exceed 3 °C/Sec, because there is rosin in the flux of solder paste, and its softening point is about 90 °C ~ 110 °C short)。 RTS: Ramp-To-Spike Heating directly to reflow, eliminating the need for a constant temperature zone RTS type reflow curve is also known as "hill type" or "ramp type". RSS (Ramp-Soak-Spike) Saddle Reflow Curve As mentioned in the previous article, so many RSS constant temperature zones prevent fluxes from achieving optimal soldering results. Therefore, the main purpose of this RTS type reflux curve is to meet the characteristics of the flux as the premise of the design of the temperature return curve, since the RSS constant temperature zone will make the flux accelerate volatilization and drying, then do not want this constant temperature zone, or change this constant temperature zone to a slow heating zone, which can not only greatly reduce the rate of flux volatilization, improve the flux residue rate during resoldering, but also improve the solderability of resoldering (if you can't understand this paragraph, Please go back to the article and revisit the characteristics of the RSS type reflow curve), and it can also shorten the time of the entire reflow through the furnace, which is equivalent to achieving the effect of saving energy, why not? However, the elimination of the "constant temperature zone" means that the "temperature difference △T" may increase, so as long as all the pads/pads on the board and the solder legs of all parts are controlled not to be too high before entering the recycle temperature, this RTS-type reflow curve should be used. Which PCBA boards are suitable for RTS reflow curve? With the development of science and technology, more and more reflow ovens now have the ability to compensate for efficient thermal energy, especially those reflow ovens with more than 10 temperature zones, which will no longer have the problem of high and low drift of temperature because of the density of the board in the reflow furnace, which is very helpful for the use of RTS in the reflow furnace, because there is a very important limitation when designing RSS, that is, the thermal efficiency of the reflow furnace cannot keep up. Therefore, having a reflow oven with high efficiency thermal compensation is an important condition for the use of RTS. RTS (Ramp-To-Spike) Ramp-To-Spike Reflow Curve Compromise Again, if the parts on your PCBA are very simple, without too many complex parts, such as BGA or large parts that are particularly easy or not easy to absorb heat, that is to say, the temperature between the parts can easily reach uniformity, it is recommended to use "RTS ramp-to-spike". However, if your board is too large or has too many layers, even if the parts are simple, it is recommended to measure whether the temperature of each key position can be consistent before entering the reflow area through the temperature measuring plate. After confirming that it is feasible, first try run a small amount to ensure that the solder defects are within the controllable range, and then produce in large quantities, and observe a few batches of no problems before you can really rest assured that the production line can change the reflow curve to RTS. The reason is that most of the plate spacing in the reflow furnace is loose during the test run, but the board spacing is shortened after a large number of productions, coupled with the insufficient energy supply of the reproduction furnace, so the phenomenon of non-tin is caused, especially the soldering pads/pads connected with a large area of grounded copper foil are more serious. Now you should know that your reflow temperature profile should be set to RSS? Or set it to RTS type~

 
As mentioned in the previous article, so many RSS constant temperature zones prevent fluxes from achieving optimal soldering results. Therefore, the main purpose of this RTS type reflux curve is to meet the characteristics of the flux as the premise of the design of the temperature return curve, since the RSS constant temperature zone will make the flux accelerate volatilization and drying, then do not want this constant temperature zone, or change this constant temperature zone to a slow heating zone, which can not only greatly reduce the rate of flux volatilization, improve the flux residue rate during resoldering, but also improve the solderability of resoldering (if you can't understand this paragraph, Please go back to the article and revisit the characteristics of the RSS type reflow curve), and it can also shorten the time of the entire reflow through the furnace, which is equivalent to achieving the effect of saving energy, why not?
 
However, the elimination of the "constant temperature zone" means that the "temperature difference △T" may increase, so as long as all the pads/pads on the board and the solder legs of all parts are controlled not to be too high before entering the recycle temperature, this RTS-type reflow curve should be used.
 
Which PCBA boards are suitable for RTS reflow curve?
With the development of science and technology, more and more reflow ovens now have the ability to compensate for efficient thermal energy, especially those reflow ovens with more than 10 temperature zones, which will no longer have the problem of high and low drift of temperature because of the density of the board in the reflow furnace, which is very helpful for the use of RTS in the reflow furnace, because there is a very important limitation when designing RSS, that is, the thermal efficiency of the reflow furnace cannot keep up. Therefore, having a reflow oven with high efficiency thermal compensation is an important condition for the use of RTS.
 
 
Should the Reflow temperature profile be set to RSS (saddle type)? Or should it be set to RTS type (ramp-up type)? TESDATA FOUND THAT MANY PCBA ENGINEERS HAVE BEEN TROUBLED BY THIS PROBLEM, BECAUSE SOME BOSSES ASKED TO TAKE RTS, BUT THEY WERE AFRAID OF IT. Actually, there is no difficulty in answering this question, but you must first understand what "RSS" and "RTS" temperature curves are, and only after understanding the purpose and limitations of their curve settings can you choose a reflow temperature profile that meets your product. In this article, TESDATA tries to sort out the characteristics of the two types of reflow soldering temperature curves, "RSS type" and "RTS type", and the problems they are currently encountering, and provide a direction to choose. TESDATA doesn't dare to say that the following are the most correct, but put forward personal opinions for your reference, please think twice before adopting. RSS:Ramp-Soak-Spike Heating-Endothermy-Reflow Some people translate the "Soak zone" in the reflow curve as "constant temperature zone" and some people translate it as "infiltration zone", but Mr. Bai suggests that it should be translated as "endothermic zone" or "active zone". As the name suggests, the temperature curve is that there will be a flat constant temperature area, because the temperature curve is drawn like a "saddle" (a flat place can sit on a person), so the "RSS type" reflow temperature curve is also called "saddle type". RSS (Ramp-Soak-Spike) The main purpose of this constant temperature zone setting before resoldering is to make all the solder pads/pads on the surface of the PCB connected with a large area of grounded copper foil and a small area of copper foil ungrounded, and so that the temperature of components and solder legs of different sizes and textures can reach the same temperature before entering the reflow area, and the best soldering effect can be achieved during resoldering, which is why Mr. Bai suggested that this area be called the "endothermic zone". Let all objects that want to enter the reflow solder absorb the heat to a consistent temperature. It's like waiting for a while before marching to battle, gathering all the scattered soldiers together, and then charging forward in one go, which is a bit similar, otherwise everyone will be easily broken by each piece. If the temperature of SMD components is uneven (the "temperature difference △T" is too large), it is easy to have the disadvantages of soldering: ▪ If the temperature of SMD components is inconsistent when entering the reflow area, it is easy to have parts that are not soldered in place (insufficient temperature) or parts that are scalded and melted (the temperature is too high or the temperature is too long). ▪ If the PCB pad/pad of the same part cannot reach the same temperature before entering the reflow zone, it is prone to tombstone effect, and BGA is prone to HoP/HiP or NWO disadvantages. ▪ If the solder pads/pads of the part and the corresponding pads cannot reach the same temperature before entering the reflow zone, it is easy to have the disadvantage that all the solder will crawl to the solder feet (siphon phenomenon) or the solder feet will not stick to the tin. In the current SAC305 lead-free solder paste resoldering process, the temperature of this constant temperature zone is usually maintained in the range of 150±10°C, and this temperature is basically maintained on the eve of the solder paste melting, on the one hand, waiting for the large army to assemble (so that the temperature tends to be consistent), on the other hand, the flux in the solder paste will begin to play the role of removing oxides. However, it should be noted that at the temperature of this constant temperature zone, the solvent originally added to the flux of the solder paste will also begin to accelerate volatilization due to the increase in temperature, although the activator will also start and begin to remove the oxide on the surface of the solder, but the best time to remove the oxide should be when the solder paste has just begun to melt, because the melted solder paste can be pushed and removed by liquid tin to the edge or outside of the entire solder, so that there will be no oxide residue when the solder is formed and cause solder defects. Therefore, according to the characteristics of the solder paste flux, theoretically, the temperature of this constant temperature zone should not be too high or too long, otherwise the flux will dry up quickly, which is not conducive to the performance of the flux when the solder is melted, because the amount of flux residue when entering the reflux area will be directly related to the quality of the soldering~ This is the key point that many PCBA engineers ignore. For this reason, all solder paste manufacturers should tell you that the temperature of the constant temperature zone should not be set too high, let alone too long, and the heating slope after the constant temperature zone should not be too low, and it is not recommended to be lower than 1 °C/Sec, the purpose is to retain the most flux into the reflow area, if the flux is greatly reduced before entering the refill, the shortcomings of air soldering (non-wetting), cold soldering (De-wetting) and HoP/HiP or NWO will be greatly increased. However, if the slope of the secondary heating is too fast, the problem of "tin splashing" will occur, imagine the situation when the pan is frying the fish too large and the fish is put into the oil pan, appropriately reducing the slope of the secondary heating will help reduce the "tin splash". Therefore, the setting of the slope is simply a narrow door. In principle, it is not recommended to exceed 3 °C/Sec, because there is rosin in the flux of solder paste, and its softening point is about 90 °C ~ 110 °C short)。 RTS: Ramp-To-Spike Heating directly to reflow, eliminating the need for a constant temperature zone RTS type reflow curve is also known as "hill type" or "ramp type". RSS (Ramp-Soak-Spike) Saddle Reflow Curve As mentioned in the previous article, so many RSS constant temperature zones prevent fluxes from achieving optimal soldering results. Therefore, the main purpose of this RTS type reflux curve is to meet the characteristics of the flux as the premise of the design of the temperature return curve, since the RSS constant temperature zone will make the flux accelerate volatilization and drying, then do not want this constant temperature zone, or change this constant temperature zone to a slow heating zone, which can not only greatly reduce the rate of flux volatilization, improve the flux residue rate during resoldering, but also improve the solderability of resoldering (if you can't understand this paragraph, Please go back to the article and revisit the characteristics of the RSS type reflow curve), and it can also shorten the time of the entire reflow through the furnace, which is equivalent to achieving the effect of saving energy, why not? However, the elimination of the "constant temperature zone" means that the "temperature difference △T" may increase, so as long as all the pads/pads on the board and the solder legs of all parts are controlled not to be too high before entering the recycle temperature, this RTS-type reflow curve should be used. Which PCBA boards are suitable for RTS reflow curve? With the development of science and technology, more and more reflow ovens now have the ability to compensate for efficient thermal energy, especially those reflow ovens with more than 10 temperature zones, which will no longer have the problem of high and low drift of temperature because of the density of the board in the reflow furnace, which is very helpful for the use of RTS in the reflow furnace, because there is a very important limitation when designing RSS, that is, the thermal efficiency of the reflow furnace cannot keep up. Therefore, having a reflow oven with high efficiency thermal compensation is an important condition for the use of RTS. RTS (Ramp-To-Spike) Ramp-To-Spike Reflow Curve Compromise Again, if the parts on your PCBA are very simple, without too many complex parts, such as BGA or large parts that are particularly easy or not easy to absorb heat, that is to say, the temperature between the parts can easily reach uniformity, it is recommended to use "RTS ramp-to-spike". However, if your board is too large or has too many layers, even if the parts are simple, it is recommended to measure whether the temperature of each key position can be consistent before entering the reflow area through the temperature measuring plate. After confirming that it is feasible, first try run a small amount to ensure that the solder defects are within the controllable range, and then produce in large quantities, and observe a few batches of no problems before you can really rest assured that the production line can change the reflow curve to RTS. The reason is that most of the plate spacing in the reflow furnace is loose during the test run, but the board spacing is shortened after a large number of productions, coupled with the insufficient energy supply of the reproduction furnace, so the phenomenon of non-tin is caused, especially the soldering pads/pads connected with a large area of grounded copper foil are more serious. Now you should know that your reflow temperature profile should be set to RSS? Or set it to RTS type~
 
Furthermore, if the parts on your PCBA are very simple and do not have too many complex parts, such as BGA or large parts that are particularly easy or not easy to absorb heat, that is to say, the temperature between the parts can easily reach uniformity, it is recommended to use "RTS rally curve".
 
However, if your board is too large or has too many layers, even if the parts are simple, it is recommended to measure whether the temperature of each key position can be consistent before entering the reflow area through the temperature measuring plate. After confirming that it is feasible, first try run a small amount to ensure that the solder defects are within the controllable range, and then produce in large quantities, and observe a few batches of no problems before you can really rest assured that the production line can change the reflow curve to RTS.
 
The reason is that most of the plate spacing in the reflow furnace is loose during the test run, but the board spacing is shortened after a large number of productions, coupled with the insufficient energy supply of the reproduction furnace, so the phenomenon of non-tin is caused, especially the soldering pads/pads connected with a large area of grounded copper foil are more serious.
 
Now you should know that your reflow temperature profile should be set to RSS? Or set it to RTS type~

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